Project Introduction:
The team conducts research on millimeter-wave chips and integrated packaging technologies. Using compound processes, several millimeter-wave chips have been developed, and through 3D integration packaging technology, millimeter-wave MiniSAR integrated front-end and millimeter-wave phased array antennas have been designed.
Application Fields:
The research outcomes can be applied in radar, communication, and countermeasure systems to achieve signal transmission and reception functions.
Technical Advantages:
Compared to traditional integration methods, this technology offers advantages such as miniaturization, low cost, and domestically controlled self-reliance.
